Micron today announced it is sending samples of its first 3D NAND flash memory to mobile device manufacturers, and said the new embedded storage is the industry’s densest and highest performing.
The new Micron Mobile 3D NAND will ship in four distinct 32GB memory cards, two of which will use the latest Universal Flash Storage (UFS) 2.1 standard. That standard offers 33% higher bandwidth over previous Micron mobile flash products.
The other two products will continue to use the more traditional embedded embedded MultiMediaCard (eMMC) 5.1 interface.
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Source: COMPUTER WORLD